A three terminal cantilever beam can be used as a switch and also for material and process characterization. This paper deals with process optimization for its fabrication with surface micromachining steps compatible with standard integrated circuit manufacturing technology. The problems encountered in each step of fabrication and possible solutions are discussed in detail. The process makes extensive use of polysilicon deposited by Low Pressure Chemical Vapour Deposition for contacts, sacrificial oxide as well as the structural layer. © 2007 IEEE.