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Analytical Estimation of Peak Temperature in Power Electronic Systems with Multi-Layered Heat Sink Including Convection Mode of Heat TransferPublished in Institute of Electrical and Electronics Engineers Inc.
2020
In this work a simple, analytic model is proposed to estimate the depth-dependent temperature profile in multilayered power electronic systems. The proposed model considers both upward and downward heat flow, with heat conduction within the structure and heat convection at the heat sink boundaries. The proposed model is verified with simulations and experimental data obtained on multi-layered power devices like solar cell and a power converter having an insulated gated bipolar transistor (IGBT) and a diode. Besides being computationally efficient, the proposed analytical model predicts the temperature profile as accurate as obtained from commercial numerical simulators. The experimental verification of the model for a multi-layered solar cell structure is also presented. © 2020 IEEE.
Topics: Heat sink (65)%65% related to the paper, Heat transfer (62)%62% related to the paper, Convection (59)%59% related to the paper, Thermal conduction (57)%57% related to the paper and Power semiconductor device (55)%55% related to the paper
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About the journal
| Journal | Data powered by Typeset2020 IEEE International Conference on Power Electronics, Smart Grid and Renewable Energy, PESGRE 2020 |
|---|---|
| Publisher | Data powered by TypesetInstitute of Electrical and Electronics Engineers Inc. |
| Open Access | No |
Authors (3)
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