Header menu link for other important links
X
A scalable curve-fit model of the substrate coupling resistances for IC design
Vijaya Kumar Gurugubelli,
Published in
2012
Pages: 353 - 357
Abstract
A new approach is presented for modeling the resistances of the substrate coupling network employed for noise calculations in the design of mixed-signal and RF ICs. The approach introduces intermediate resistances having progressively simpler current flow patterns than the coupling resistances. Each coupling resistance is then modeled as the product of two resistance ratios and a resistance having simple 1-D vertical or lateral flow, and each resistance ratio is approximated as a simple function of geometrical aspect ratios. Based on this approach, closed-form expressions are derived for coupling resistances associated with parallel stripe contacts on a substrate with or without a bottom contact, in terms of dimensions of the contact configuration and substrate parameters. © 2012 IEEE.
About the journal
JournalProceedings - International Symposium on Quality Electronic Design, ISQED
ISSN19483287
Open AccessNo
Concepts (21)
  •  related image
    BOTTOM CONTACTS
  •  related image
    Closed form
  •  related image
    Closed-form expression
  •  related image
    Compact model
  •  related image
    COUPLING RESISTANCE
  •  related image
    Current flows
  •  related image
    CURVE-FIT
  •  related image
    Geometrical aspects
  •  related image
    IC DESIGNS
  •  related image
    INTERMEDIATE RESISTANCE
  •  related image
    LATERAL FLOW
  •  related image
    Mixed signal
  •  related image
    PARALLEL STRIPES
  •  related image
    Resistance ratio
  •  related image
    SUBSTRATE COUPLINGS
  •  related image
    SUBSTRATE NOISE
  •  related image
    SUBSTRATE PARAMETERS
  •  related image
    Aspect ratio
  •  related image
    Curve fitting
  •  related image
    Design
  •  related image
    Substrates