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Wafer bonding - A powerful tool for MEMS
Aparna Das Gupta, P. R.S. Rao, , K. Sivakumar, L. Helen Anitha
Published in
Volume: 45
Issue: 4
Pages: 311 - 316
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropump have been discussed. The results on the piezoresistive pressure sensors monolithically integrated with a MOSFET differential amplifier circuit have been presented to demonstrate the important role played by the Silicon Fusion Bonding technique for integration of sensors with electronics on a single chip.
About the journal
JournalIndian Journal of Pure and Applied Physics
Open AccessNo