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The effects of die angle on texture and annealing response of ETP copper wire
F.F. Kraft, , G. Baker, R.N. Wright
Published in Elsevier BV
1996
Volume: 60
   
Issue: 1-4
Pages: 171 - 178
Abstract
As-annealed, 2.47 mm ETP copper wire was drawn in five passes to 1.45 mm using carbide dies with nominal included angles of 8, 16 and 24 degrees. A single die, low speed drawing block was used, and the lubricant was fat-based and water soluble. Annealing was undertaken in a box furnace, for six minutes at temperatures ranging from 185 to 230°C. Annealing response and texture evolution were assessed by way of tensile tests, microhardness measurements and x-ray diffraction. Redundant strain accumulation was projected by way of deformation zone geometry, or Δ, analysis. The as-drawn wire reveals volumes of (111) and (200) fiber texture, as well as a significant volume of essentially randomly oriented grain structure. The ratio of (111) to (200) texture decreases as die angle increases. Increases in die angle and related redundant strain promote the development of random orientation and reduce the sharpness of the (111) and (200) texture components. Increases in die angle and related redundant strain also lower the annealing temperature range and cause non-uniform recrystallization, presumably due to redundant strain and texture gradients. The as-annealed 1.45 mm wire displays a large volume of randomly oriented grain structure for all three die angles. In the case of the as-annealed wire, increases in die angle are associable with a decrease in the volume percent of (111) fiber texture, a decrease in the sharpness of the (200) fiber texture, and an increase in randomly oriented grain structure.
About the journal
JournalData powered by TypesetJournal of Materials Processing Technology
PublisherData powered by TypesetElsevier BV
ISSN09240136