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Tapering and size reduction of single-mode silicon waveguides by maskless RIE
Published in
2012
Pages: 655 - 656
Abstract
Two-step reactive ion etching process has been optimized to demonstrate small cross-section single-mode silicon waveguides. This technique has helped to reduce the insertion loss of compact integrated photonic devices in SOI platform up to 3 dB. © 2012 IEEE.
About the journal
JournalTechnical Digest - 2012 17th Opto-Electronics and Communications Conference, OECC 2012
Open AccessNo
Concepts (13)
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    INTEGRATED PHOTONIC DEVICES
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    MASK LESS
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    REACTIVE ION
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    SILICON ON INSULATOR
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    Silicon photonics
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    SILICON WAVEGUIDE
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    Single mode
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    Size reductions
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    Integrated optics
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    Photonic devices
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    Photonics
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    Silicon on insulator technology
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    Waveguides