The drying of a sessile drop consisting of colloidal particles and the formation of particulate deposits with spatially periodic cracks were ubiquitous. The drying induced stress, which is generated during the evaporation of a colloidal drop, is released by the formation of cracks. We find that the morphology of cracks formed in particulate films dried at substrate temperature, Tsub = 25 °C is markedly different from that of cracks formed at Tsub > 45 °C. The cracks are disordered in the former case, but ordered and periodic in the latter. The disorderedness of cracks observed at Tsub = 25 °C is mainly due to the formation of a coffee-ring like particle deposit that exhibits a larger height gradient. The ultimate deposit pattern after complete drying is observed to be different for colloidal dispersion drops evaporated at different substrate temperatures. This is attributed to temperature-dependent solvent flow mechanisms and capillary-driven flow, which occur inside the colloidal drop during the course of drying. In addition, for the coffee-ring-like particulate deposit obtained at Tsub ≤ 45 °C, the ratio between the width of the deposit w and the radius of the ring R scales with the volume fraction of the colloids φ, w/R ∼ φ0.5, in the range of volume fractions studied in this work. The deposited patterns obtained at temperature Tsub > 45 °C are largely dominated by the capture of particles by the receding liquid-vapor interface. This is due to the faster rate of decrease of the liquid-vapor interface position with an increase in substrate temperature. © 2017 The Royal Society of Chemistry.