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SER mitigation technique through selective flip-flop replacement
Published in Institute of Electrical and Electronics Engineers Inc.
2015
Pages: 25 - 30
Abstract
The advancement in the semiconductor manufacturing process has reduced the device dimensions, which in turn has reduced design and manufacturing costs of the Integrated Chips (IC). This has accelerated the IC penetration in automobiles, health care and safety critical systems. However, the smaller device dimensions have made the ICs vulnerable to soft-errors. The sequential cells in a given design contribute significantly to its soft-error rate (SER). Some of the soft-errors get masked and do not cause any adverse impact. The masking can occur due to logic or timing reasons. This paper presents a flow that uses the Timing Vulnerability Factor (TVF) and Architecture Vulnerability Factor (AVF) of the sequential instances in a given design to reduce its soft-error rate (SER). The paper proposes a novel method to efficiently compute the TVF and AVF parameters followed by a linear programming technique that uses these parameters to reduce the SER of the given design. Using the proposed technique, we have reduced the sequential cell contribution to the SER of an in-house IP design by 36% for an increase of 9% in sequential cells area. © 2015 IEEE.
About the journal
JournalData powered by TypesetProceedings of the 6th Asia Symposium on Quality Electronic Design, ASQED 2015
PublisherData powered by TypesetInstitute of Electrical and Electronics Engineers Inc.
Open AccessNo
Concepts (17)
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    Design
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    Error correction
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    Errors
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    Flip flop circuits
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    Linear programming
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    Manufacture
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    Radiation hardening
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    Semiconductor device manufacture
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    INTEGRATED CHIPS
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    LINEAR PROGRAMMING TECHNIQUES
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    Manufacturing cost
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    MITIGATION TECHNIQUES
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    Safety critical systems
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    SEMICONDUCTOR MANUFACTURING PROCESS
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    Soft error rate
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    VULNERABILITY FACTORS
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    Integrated circuit design