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Numerical modelling of microscale heat conduction effects in electronic package for different thermal boundary conditions
Published in Institute of Electrical and Electronics Engineers Inc.
2000
Volume: 2000-January
   
Pages: 53 - 59
Abstract
The reduction of semiconductor device size to the submicrometer range leads to unique electrical and thermal phenomena. The Fourier conduction effect was not enough to explain the phenomena and we need to bring in nonFourier conduction effects to analyse microelectronic devices. A two-phase lag model is used here to bring in the nonFourier effects. A numerical solution procedure based on the finite element method and fourth order Runge-Kutta time marching procedure has been employed for the spatial and temporal discretisations respectively. The predicted results for different boundary conditions clearly capture thermal wave-like and pure diffusion type phenomena in the appropriate range of time lag values. In electronic packaging, the microscale heat conduction must be considered in view of higher heat fluxes encountered recently, especially when we deal with transient heat transfer. A two dimensional case is considered as a first step. The results are encouraging. © 2000 IEEE.
About the journal
JournalData powered by TypesetProceedings of the Electronic Packaging Technology Conference, EPTC
PublisherData powered by TypesetInstitute of Electrical and Electronics Engineers Inc.
Open AccessNo
Concepts (22)
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    Boundary conditions
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    Electronics packaging
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    Finite element method
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    Heat transfer
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    Microelectronics
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    Microscopic examination
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    Numerical methods
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    Numerical models
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    Runge kutta methods
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    Semiconductor devices
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    Space heating
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    Temperature
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    Thermal conductivity
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    Different boundary condition
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    ELECTRONIC PACKAGING THERMAL MANAGEMENTS
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    Equations
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    FOURTH-ORDER RUNGE-KUTTA
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    Micro-electronic devices
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    MICROSCALE HEAT CONDUCTION
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    Thermal boundary conditions
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    Thermal engineering
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    Heat conduction