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Extraction of residual stress and dimensions from electrical measurements on surface micromachined test structures
Published in SPIE
2009
Volume: 8
   
Issue: 3
Abstract
The deposited thin films in surface micromachining have a lot of residual stress, and it is essential to measure this for both process development and monitoring. We estimate residual stress by electrical measurements on a series of fixed-fixed polysilicon beams designed to deflect laterally due to stress. To minimize errors in estimation during parameter extraction, the device dimensions also have to be measured accurately. Surface micromachining of an oxide-anchored polysilicon cantilever beam can result in beam undercut, reduction in beam thickness, and increase in the gap between the beam and the substrate. The undercut in the beam is estimated from the resonance frequency of the cantilever beam and also by using polysilicon resistors. Final device thickness is obtained by measuring the resistance in fixed-fixed beams. © 2009 Society of Photo-Optical Instrumentation Engineers.
About the journal
JournalData powered by TypesetJournal of Micro/Nanolithography, MEMS, and MOEMS
PublisherData powered by TypesetSPIE
ISSN19325150
Open AccessNo
Concepts (22)
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    Cantilever beams
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    Composite micromechanics
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    Micromachining
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    Nanocantilevers
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    Natural frequencies
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    Parameter extraction
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    Pile foundations
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    Polysilicon
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    Residual stresses
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    SURFACE MICROMACHINING
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    BEAM THICKNESS
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    Electrical measurement
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    FIXED-FIXED BEAMS
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    Gap
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    Micromachined
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    POLYSILICON RESISTORS
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    Process development
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    Resonance frequencies
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    Resonance frequency
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    Test structure
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    UNDERCUT
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    Electric variables measurement