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Estimation of in-plane thermal conductivity of copper clad board by inverse analysis using artificial neural networks
K. Niju Mohammed
Published in Institute of Physics Publishing
2018
Volume: 396
   
Issue: 1
Abstract
This study presents a methodology to estimate the in-plane thermal conductivity of copper clad board used in electronic applications. Experiments are performed in vacuum environment and an inverse heat conduction problem (IHCP) is solved employing artificial neural networks to estimate the in-plane thermal conductivity. A comparison of estimates of thermal conductivity as obtained by solving the inverse problem using back propagation artificial neural networks trained using two algorithms namely Levenberg-Marquardt and Scaled Conjugate Gradient are presented. © Published under licence by IOP Publishing Ltd.
About the journal
JournalIOP Conference Series: Materials Science and Engineering
PublisherInstitute of Physics Publishing
ISSN17578981
Open AccessYes
Concepts (12)
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    Backpropagation algorithms
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    Heat conduction
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    Inverse problems
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    Neural networks
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    BACK PROPAGATION ARTIFICIAL NEURAL NETWORK (BPANN)
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    ELECTRONIC APPLICATION
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    In-vacuum
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    Inverse analysis
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    Inverse heat conduction problem
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    Levenberg-marquardt
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    SCALED CONJUGATE GRADIENTS
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    Thermal conductivity