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Electrical characterization of metal-insulator-semiconductor capacitors with xerogel as dielectric
Published in
2002
Volume: 80
   
Issue: 10
Pages: 1800 - 1802
Abstract
Xerogel films have been prepared on p-type silicon (pSi) substrates by the sol-gel process using hexamethyldisilazane for surface modification. The dielectric constants of the films are in the range of 1.9-2.5. Detailed electrical characterization has been carried out using an aluminum-xerogel-pSi metal-insulator-semiconductor structure. Low values of fixed oxide charges, mobile oxide charges, and interface state densities have been obtained. The low leakage current density and high breakdown field strength of these films make them suitable for intermetal isolation. Very little degradation of the film properties was observed even after 40 days without any capping layer. © 2002 American Institute of Physics.
About the journal
JournalApplied Physics Letters
ISSN00036951
Open AccessNo
Authors (3)
Concepts (19)
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    Capping layer
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    Dielectric constants
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    Electrical characterization
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    FILM PROPERTIES
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    HEXAMETHYLDISILAZANE
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    HIGH BREAKDOWN FIELDS
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    Interface state density
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    Low-leakage current
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    METAL INSULATOR SEMICONDUCTOR CAPACITORS
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    Metal insulator semiconductor structures
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    OXIDE CHARGE
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    P-TYPE SILICON
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    XEROGEL FILMS
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    Metal insulator boundaries
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    Mis devices
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    Semiconducting silicon
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    Sol-gel process
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    Xerogels
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    Semiconductor insulator boundaries