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Conjugate natural convection cooling of protruding heat sources mounted on a substrate place inside an enclosure: A parametric study
V. M.K. Sastri
Published in Elsevier Science S.A., Lausanne, Switzerland
2000
Volume: 188
   
Issue: 1-3
Pages: 187 - 202
Abstract
The present work demonstrates a parametric study for a conjugate natural convection cooled substrate mounted heat sources placed inside an enclosure. This particular situation has direct relevance in electronic cooling applications. The governing coupled non-dimensional transport equations were solved using the finite volume technique. It is found that Ra. Pr and enclosure boundary condition affects strongly the fluid flow and heat transfer characteristics. It is concluded that non-dimensional temperature is maximum for Pr = 150. Numerical correlation for maximum protrusion temperature and Nusselt number were presented for wide range of Pr, Ra and enclosure boundary conditions. (C) 2000 Published by Elsevier Science S.A. All rights reserved.The present work demonstrates a parametric study for a conjugate natural convection cooled substrate mounted heat sources placed inside an enclosure. This particular situation has direct relevance in electronic cooling applications. The governing coupled non-dimensional transport equations were solved using the finite volume technique. It is found that Ra,Pr and enclosure boundary condition affects strongly the fluid flow and heat transfer characteristics. It is concluded that non-dimensional temperature is maximum for Pr = 150. Numerical correlation for maximum protrusion temperature and Nusselt number were presented for wide range of Pr,Ra and enclosure boundary conditions.
About the journal
JournalData powered by TypesetComputer Methods in Applied Mechanics and Engineering
PublisherData powered by TypesetElsevier Science S.A., Lausanne, Switzerland
ISSN00457825
Open AccessNo
Concepts (14)
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    Boundary conditions
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    Cooling
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    Correlation methods
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    Finite volume method
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    Natural convection
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    Nusselt number
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    Substrates
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    Transport properties
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    Electronic cooling
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    NON-DIMENSIONAL TRANSPORT EQUATIONS
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    Computational fluid dynamics
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    Electronic equipment
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    Fluid flow
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    Heat transfer