This paper presents the results of Stress Intensity Factors (SIFs) for a crack emanating from a finite width plate with pin loaded cracked hole, through a 2-D plane stress Finite Element analysis using ANSYS®. The effect of pin-hole interference and additional stress relieving holes in the plate is investigated. Initial studies were performed on the pin-loaded plate with various crack sizes at the center of the plate, with different interference levels, typical of industrial components. Later, parametric studies were conducted by inserting an additional hole of different diameters placed at a distance from the central cracked hole that acts as stress reliever. The synergistic effect of interference and additional hole in reducing the SIF has been analyzed and the most beneficial interference level, diameter of additional hole and its position has been identified. © 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0)