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Analysis of copper dissolution in glutamic acid and hydrogen peroxide using EIS
Published in
2011
Volume: 33
   
Issue: 15
Pages: 37 - 50
Abstract
The dissolution of copper in solutions containing Glutamic acid and hydrogen peroxide is analyzed using EIS. Potentiodynamic polarization studies show that there is no strong passivating layer formed on the copper surface in solutions containing 0.5 wt% Glu and 0.1 vol% hydrogen peroxide. Electrochemical impedance spectra of copper in this solution at various overpotential were acquired and modeled using electrical equivalent circuit and reaction mechanism analysis. The results show that the reaction involves at least two adsorbed intermediates. ©The Electrochemical Society.
About the journal
JournalECS Transactions
ISSN19385862
Open AccessNo
Concepts (15)
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    ADSORBED INTERMEDIATES
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    COPPER DISSOLUTION
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    Copper surface
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    Electrical equivalent circuit
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    ELECTROCHEMICAL IMPEDANCE SPECTRA
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    Glutamic acid
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    OVERPOTENTIAL
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    Passivating layer
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    POTENTIODYNAMIC POLARIZATION STUDIES
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    REACTION MECHANISM ANALYSIS
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    Amino acids
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    Copper
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    Hydrogen peroxide
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    Reaction intermediates
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    Electrochemical corrosion