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A serial solution for the 2-D inverse heat conduction problem for estimating multiple heat flux componentsPublished in

2004

Volume: 45

Issue: 6

Pages: 541 - 563

A serial algorithm for the inverse heat conduction problem (IHCP) has been developed to estimate the individual flux components, one by one, at the unknown boundary, based on the function specification method. The sensitivity coefficient defined in this algorithm brings out the influence of the heat flux components independent of each other. The objective function minimizes the difference in the measured temperature and the contribution of the individual flux component to the thermal field at the sensor location. The serial algorithm developed here could be used with data from both overspecified and underspecified sensors with respect to the number of flux components. The method was tested for delineating independent heat fluxes at the boundary of a two-dimensional solid for both space- and time-varying heat fluxes. Simulated thermal histories obtained from direct solution were used as inputs for the inverse problem for characterizing the new algorithm. Three types of analyses were done on the results of the IHCP, focused on (1) the convergence of error in estimated temperatures at the different sensor locations, (2) overall error in estimated temperatures for the whole domain, and (3) the total heat energy transferred across the boundary. It is shown that the optimum configuration of independent unknown fluxes is given by the one with minimum energy estimates across the boundary, for both cases.

Topics: Heat flux (66)%66% related to the paper, Thermal conduction (57)%57% related to the paper, Inverse problem (52)%52% related to the paper and Boundary value problem (51)%51% related to the paper

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About the journal

Journal | Numerical Heat Transfer, Part B: Fundamentals |
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ISSN | 10407790 |

Open Access | No |

Concepts (11)

- Algorithms
- Boundary conditions
- Error analysis
- Heat flux
- Parameter estimation
- Problem solving
- Sensors
- HEAT FLUX COMPONENTS
- Sensor location
- TWO-DIMENSIONAL SOLIDS
- Heat conduction